JPH029555Y2 - - Google Patents

Info

Publication number
JPH029555Y2
JPH029555Y2 JP19936384U JP19936384U JPH029555Y2 JP H029555 Y2 JPH029555 Y2 JP H029555Y2 JP 19936384 U JP19936384 U JP 19936384U JP 19936384 U JP19936384 U JP 19936384U JP H029555 Y2 JPH029555 Y2 JP H029555Y2
Authority
JP
Japan
Prior art keywords
frame
presser
movable body
lead frame
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19936384U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61114831U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19936384U priority Critical patent/JPH029555Y2/ja
Publication of JPS61114831U publication Critical patent/JPS61114831U/ja
Application granted granted Critical
Publication of JPH029555Y2 publication Critical patent/JPH029555Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP19936384U 1984-12-28 1984-12-28 Expired JPH029555Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19936384U JPH029555Y2 (en]) 1984-12-28 1984-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19936384U JPH029555Y2 (en]) 1984-12-28 1984-12-28

Publications (2)

Publication Number Publication Date
JPS61114831U JPS61114831U (en]) 1986-07-19
JPH029555Y2 true JPH029555Y2 (en]) 1990-03-09

Family

ID=30759216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19936384U Expired JPH029555Y2 (en]) 1984-12-28 1984-12-28

Country Status (1)

Country Link
JP (1) JPH029555Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7715055B2 (ja) * 2022-02-21 2025-07-30 三菱電機株式会社 半導体製造装置及び半導体製造方法

Also Published As

Publication number Publication date
JPS61114831U (en]) 1986-07-19

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